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Micromachining of Polyimide Driven by a High Average Power IR FEL

(WE-Wrk-1-03)



Michael J. Kelley  



Thomas Jefferson National Accelerator Facility and The College of William & Mary



The long history and wide use of polyimide as a dielectric in the microelectronics industry has made it a favorite material for laser processing studies. The FEL used in the present work delivered picosecond-long 25 microjoule pulses at approximately 3.10 and 5.80 microns. The former is not associated with any strong absorption, while the latter is polyimide's strongest absorption band in the IR. This study explored hole drilling and surface transformation of as-made and aluminized DuPont Kapton* HN PMDA-ODA polyimde film.



FEL 2000